Stacked chip assembly with encapsulant layer

Details Stacked chip assembly with encapsulant layer Stacked chip assembly with encapsulant layer

2002-08-22

2009-10-20

Pham, Thanh V (Department: 2894)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Flip chip

C257S779000, C257S777000, C257S780000, C257S781000, C257SE21503

Reexamination Certificate

active

07605479

ABSTRACT:
A microelectronic subassembly210includes a substrate215having a top surface216and at least one peripheral region219,a microelectronic element201mounted over the substrate215,a plurality of leads218, 222electrically connected to the microelectronic element201having outer ends overlying the at least one peripheral region219of the substrate215,and vertical conductors208electrically connected with the outer ends of the leads. The subassembly includes an encapsulant layer204provided over the top surface216of the substrate215and around the microelectronic element201and the vertical conductors208for stiffening the substrate215at the at least one peripheral region219of the substrate for facilitating handling and testing of the subassembly.

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