Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
Reexamination Certificate
2006-06-30
2009-06-30
Potter, Roy K (Department: 2822)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Chip mounted on chip
C257S778000
Reexamination Certificate
active
07554203
ABSTRACT:
An integrated circuit (“IC”) package having two or more dice stacked on a substrate and electrically coupled using two or more different connection technologies may improve high-speed input/output (“I/O”) bandwidth. In an embodiment, one die is a processor and at least one other die is a dynamic random access memory (“DRAM”). One or more of the dice may be thinned and placed between the substrate and a portion of one or more of the other dice, which may be horizontally offset. One or more of the dice may be embedded in the substrate. The dice may be coupled to each other and to the substrate using a combination of controlled-collapse chip connection (“C4”) and wirebonding connection technologies. Methods of fabrication, and application of the package to an electronic assembly and to an electronic system, are also described.
REFERENCES:
patent: 6407456 (2002-06-01), Ball
He Jiangqi
Lu Daoqiang
Shi Wei
Zhou Qing A
Intel Corporation
Potter Roy K
Schwegman Lundberg & Woessner, P.A.
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