Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate
2005-08-31
2009-11-10
Chu, Chris C (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Multiple housings
C257SE21614, C257S685000, C257S723000, C257S777000, C438S108000, C438S109000, C361S760000
Reexamination Certificate
active
07615856
ABSTRACT:
An integrated antenna type circuit apparatus which provides excellent circuit characteristics while suppressing an increase in packaging area. The integrated antenna type circuit apparatus includes an insulating base, a semiconductor circuit device, chip parts, a molding resin, an antenna conductor, a ground conductor, and external lead electrodes. The plurality of chip parts are mounted on the insulating base, and are soldered to electrodes of wiring conductors on the top of the insulating base for electric and physical connection. The insulating base has a multilayer structure, being formed by laminating a plurality of insulator layers. The antenna conductor is formed on the bottom of the insulating base. A wiring conductor adjacent to the antenna conductor is provided with the ground conductor so that it overlaps with the antenna conductor.
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Inoue Yasunori
Sakai Atsushi
Usui Ryosuke
Chu Chris C
McDermott Will & Emery LLP
Sanyo Electric Co,. Ltd.
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