Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2006-11-14
2009-06-30
Pham, Thanhha (Department: 2894)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C438S614000, C438S652000, C257SE21508
Reexamination Certificate
active
07553750
ABSTRACT:
A method for fabricating an electrical conductive structure of a circuit board is disclosed. The method includes providing a circuit board having a plurality of first and second electrically conductive pads; forming on the circuit board an insulating protection layer having a plurality of openings for exposing the first and second electrically conductive pads; forming a metal adhesive layer on the first and second electrically conductive pads; forming a conductive layer on the insulating protection layer and on the metal adhesive layer formed on the first and second electrically conductive pads, the conductive layer being electrical conductive to the first and second electrically conductive pads; forming on the conductive layer a resist layer having a plurality of openings for exposing the conductive layer on the second electrically conductive pads; and electroplating a conductive structure on the conductive layer on the second electrically conductive pads exposed from the openings.
REFERENCES:
patent: 6782897 (2004-08-01), Wang et al.
Pham Thanhha
Phoenix Precision Technology Corporation
LandOfFree
Method for fabricating electrical conductive structure of... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method for fabricating electrical conductive structure of..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for fabricating electrical conductive structure of... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4090993