Semiconductor device manufacturing: process – Making device or circuit responsive to nonelectrical signal – Physical stress responsive
Reexamination Certificate
2006-12-18
2009-08-04
Le, Dung A. (Department: 2818)
Semiconductor device manufacturing: process
Making device or circuit responsive to nonelectrical signal
Physical stress responsive
C438S055000, C438S106000
Reexamination Certificate
active
07569410
ABSTRACT:
An integrated MEMS package and associated packaging method are provided. The method includes: forming an electrical circuit, electrically connected to the first substrate; integrating a MEMS device on a first substrate region, electrically connected to the first substrate; providing a second substrate overlying the first substrate; and, forming a wall along the first region boundaries, between the first and second substrate. In one aspect, the electrical circuit is formed using thin-film processes; and, wherein integrating the MEMS device on the first substrate region includes forming the MEMS using thin-film processes, simultaneous with the formation of the electrical device. Alternately, the MEMS device is formed in a separate process, attached to the first substrate, and electrical interconnections are formed to the first substrate using thin-film processes.
REFERENCES:
patent: 6624003 (2003-09-01), Rice
Brownlow Michael James
Hartzell John W.
Walton Harry Garth
Law Office of Gerald Maliszewski
Le Dung A.
Maliszewski Gerald
Sharp Laboratories of America Inc.
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