Method for manufacturing electronic device

Details Method for manufacturing electronic device Method for manufacturing electronic device

2005-10-26

2009-06-02

Sarkar, Asok K (Department: 2891)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C257SE21579, C438S597000

Reexamination Certificate

active

07541281

ABSTRACT:
A method for manufacturing an electronic device, in which a via hole and a trench for an interconnect are integrally provided in an interlayer insulating film formed on a substrate, and the via hole and the trench for the interconnect are plugged with an electric conductor film is provided. The method includes: forming a via hole in the interlayer insulating film; forming a resin film plugging the via hole on the interlayer insulating film; etching the resin film exposed outside the via hole off with an etching gas mainly containing an active hydrogen species to form a dummy plug composed of the resin film in the via hole; forming a resist mask having an opening for an interconnect on the dummy plug and on the interlayer insulating film.

REFERENCES:
patent: 7048869 (2006-05-01), Takahashi et al.
patent: 2002/0197846 (2002-12-01), Suzawa et al.
patent: 2005/0009324 (2005-01-01), Li et al.
patent: 2005/0233572 (2005-10-01), Su et al.
patent: 2007/0087554 (2007-04-01), Louis
patent: 2004-111950 (2004-04-01), None
Quirk, M. et al., Semiconductor Manufacturing Technology, 2001, Prentice-Hall, p. 351.

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