Semiconductor integrated device and method of providing...

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Reexamination Certificate

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Details

C257S393000, C438S396000, C438S622000

Reexamination Certificate

active

07576382

ABSTRACT:
A method of providing shield interconnection, the method shielding an interconnection pattern to be shielded with shield interconnection patterns for shielding on the substrate of a semiconductor integrated device, is disclosed. The method includes the steps of disposing multiple interconnection layers having the corresponding shield interconnection patterns formed therein so that the interconnection layers surround the interconnection pattern to be shielded; setting different potentials for at least a first one of the shield interconnection patterns formed in a first one of the interconnection layers and a second one of the shield interconnection patterns formed in a second one of the interconnection layers; and shielding the interconnection pattern to be shielded with the first one and the second one of the shield interconnection patterns.

REFERENCES:
patent: 6066537 (2000-05-01), Poh
patent: 2003/0062564 (2003-04-01), Kobayashi et al.
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patent: 2000-150802 (2000-05-01), None
patent: 2000-269211 (2000-09-01), None
patent: 2000-353785 (2000-12-01), None
patent: 2001-44305 (2001-02-01), None
patent: 2001-144091 (2001-05-01), None

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