Semiconductor device capable of easily filling contact conductor

Details Semiconductor device capable of easily filling contact conductor Semiconductor device capable of easily filling contact conductor

1998-06-16

1999-05-25

Picardat, Kevin M.

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

438626, 438637, H01L 214763

Patent

active

059077883

ABSTRACT:
In a semiconductor device having an impurity diffusion layer in a surface part of a semiconductor surface and a first insulator layer formed on the semiconductor substrate and the impurity diffusion layer, the first insulator layer has a first recessed surface which defines a first contact hole. A first contact conductor plug is filled in the first contact hole. A second insulator layer is formed on the first insulator layer and a first upper plug surface of the first contact conductor plug. The second insulator layer has a second recessed surface which defines a second contact hole exposing the first upper plug surface. A second contact conductor plug is filled in the second contact hole to overlie the first upper plug surface and to be brought into contact with the second recessed surface. A conductor pad may be disposed between the first and the second contact conductor plugs.

REFERENCES:
patent: 5063175 (1991-11-01), Broadbent
patent: 5110762 (1992-05-01), Nakahara et al.
patent: 5258329 (1993-11-01), Shibata
patent: 5262353 (1993-11-01), Sun et al.
patent: 5403781 (1995-04-01), Matsumoto et al.
patent: 5436199 (1995-07-01), Brighton
patent: 5529945 (1996-06-01), Rao
patent: 5571751 (1996-11-01), Chung
patent: 5616519 (1997-04-01), Ping
patent: 5702482 (1997-12-01), Lee et al.
patent: 5728626 (1998-03-01), Allman et al.
T. Kikkawa, et al., "Quarter-Micron Interconnection Technologies for 256-Mbit Dynamic Random Access Memories", Jpn. J. Appl. Phys., vol. 32, Part I, No. 1B, Jan. 1993, pp. 338-346.

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