Semiconductor device having an inspection hole striding a...

Details Semiconductor device having an inspection hole striding a... Semiconductor device having an inspection hole striding a...

2006-01-05

2009-10-13

Parker, Kenneth A (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified material other than unalloyed aluminum

C257S773000, C257S774000, C257SE21522, C257SE21523

Reexamination Certificate

active

07602064

ABSTRACT:
The semiconductor device includes a semiconductor substrate, a diffusion layer, an interconnect layer, a contact plug, a contact-inspection hole, a via plug, and a via-inspection hole. Similarly to a contact plug hole, the contact-inspection hole extends from the diffusion layer to the interconnect layer. The opening of the contact-inspection hole on the side of the diffusion layer is disposed across the boundary of the diffusion layer. Also, similarly to a via plug hole, the via-inspection hole extends from an interconnect to an interconnect layer. The opening of the via-inspection hole on the side of the interconnect is disposed across the boundary of the interconnect.

REFERENCES:
patent: 5846876 (1998-12-01), Bandyopadhyay et al.
patent: 2005/0179134 (2005-08-01), Matsubara
patent: 2005/0200026 (2005-09-01), Liaw
patent: 04-012531 (1992-01-01), None
patent: 10-256366 (1998-09-01), None
patent: 11-163133 (1999-06-01), None
patent: 2003-124277 (2003-04-01), None
patent: 2004-119449 (2004-04-01), None

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