Semiconductor package substrate having contact pad...

Details Semiconductor package substrate having contact pad... Semiconductor package substrate having contact pad...

2006-06-06

2009-02-03

Huynh, Andy (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Solder wettable contact, lead, or bond

C257S690000, C257S737000, C257S751000, C257S753000, C257SE21175, C257SE23060, C257SE23062, C257SE23067

Reexamination Certificate

active

07485970

ABSTRACT:
A semiconductor package substrate and a method for fabricating the same are proposed. An insulating layer has a plurality of blind vias to expose inner traces underneath the insulating layer. A conductive film is formed on the insulating layer and over the bind vias. A first resist is formed on the conductive film, having openings to expose parts of the conductive film. A patterned trace layer including a plurality of contact pads is formed in the openings and the blind vias to form conductive vias, with at least one contact pad electrically connected to one conductive via. A second resist is formed on the patterned trace layer without covering the contact pads. A metal barrier layer is formed on the contact pads. Finally, the first and second resists and parts of the conductive film covered the first resist are removed.

REFERENCES:
patent: 5083187 (1992-01-01), Lamson et al.
patent: 5242861 (1993-09-01), Inaba
patent: 5633189 (1997-05-01), Yen et al.
patent: 5907786 (1999-05-01), Shinomiya
patent: 6407459 (2002-06-01), Kwon et al.
patent: 6566239 (2003-05-01), Makino et al.
patent: 6713859 (2004-03-01), Ma
patent: 6841413 (2005-01-01), Liu et al.
patent: 7205674 (2007-04-01), Huang et al.
patent: 2002/0070443 (2002-06-01), Mu et al.
patent: 2002/0127780 (2002-09-01), Ma et al.
patent: 2003/0127715 (2003-07-01), Liu et al.

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