Manufacturing method of solder ball disposing surface...

Details Manufacturing method of solder ball disposing surface... Manufacturing method of solder ball disposing surface...

2007-10-17

2009-06-09

Menz, Laura M (Department: 2813)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S612000, C438S615000

Reexamination Certificate

active

07544599

ABSTRACT:
A manufacturing method of a solder ball disposing surface structure on a core board including: providing a core board with a first metal layer and an opposing metal bump-equipped second metal layer; forming resists on the first and second metal layers respectively; forming third, fourth and fifth openings in the resists; removing the first and second metal layers in the third and fourth openings to form first and second circuit layers and metal pads respectively; removing the metal bumps in the fifth openings to form metal flanges; removing the resists; forming first and second insulative protection layers on the first and second circuit layers and metal pads respectively; forming first and second openings in the first and second insulative protection layers to expose the first circuit layer as electrical connecting pads and expose the metal flanges respectively. Accordingly, increased contact surface area for mounting conductive elements prevents detachment thereof.

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