Method of manufacturing inductor

Details Method of manufacturing inductor Method of manufacturing inductor

2007-09-05

2009-08-04

Kim, Paul D (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S602100, C029S847000, C029S852000, C216S062000, C216S065000, C216S066000, C336S110000, C336S175000, C336S178000, C336S184000, C336S214000, C363S017000, C363S048000, C363S058000

Reexamination Certificate

active

07568278

ABSTRACT:
A method for manufacturing an inductor using a system-in-package (SIP) includes forming a first penetration electrode in a silicon substrate; depositing an insulating film on a first surface of the silicon substrate, and patterning the insulating film to form an inductor hole and a second penetration hole aligned with the first penetration hole; forming an inductor in the inductor hole and a second penetration electrode in the second penetration hole; and depositing a protective film on the insulating film and performing a back grind process such that the first penetration electrode is exposed from a second surface of the silicon substrate, the second surface being opposed to the first surface.

REFERENCES:
patent: 5756395 (1998-05-01), Rostoker et al.
patent: 6781224 (2004-08-01), Yoneda et al.
patent: 2005/0221601 (2005-10-01), Kawano
patent: 2007/0155152 (2007-07-01), Kang
patent: 2007/0246816 (2007-10-01), Tajika et al.

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