Methods of manufacturing a three-dimensional semiconductor...

Details Methods of manufacturing a three-dimensional semiconductor... Methods of manufacturing a three-dimensional semiconductor...

2007-01-09

2009-10-20

Smith, Matthew (Department: 2823)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

C438S455000, C257SE23080

Reexamination Certificate

active

07605022

ABSTRACT:
A method of fabricating a three-dimensional semiconductor device is provided along with a three-dimensional semiconductor device fabricated thereby. The method includes forming a heat conductive plug to channel heat away from devices on a substrate, while high temperature processes are performed on a stacked semiconductor layer. The ability to use high temperature processes on the stacked semiconductor layer without adversely effecting devices on the substrate allows the formation of a high quality single-crystalline stacked semiconductor layer. The high quality single-crystalline semiconductor layer can then be used to fabricate improved thin film transistors.

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