Semiconductor module and heat radiating plate

Details Semiconductor module and heat radiating plate Semiconductor module and heat radiating plate

2007-07-10

2009-10-06

Chervinsky, Boris L (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S704000, C361S715000, C257S712000, C257S718000, C165S080300

Reexamination Certificate

active

07599187

ABSTRACT:
A semiconductor module in which a plurality of kinds of semiconductor devices having different heat generating amounts in being operated are mixedly present, heat conducting sheets are interposed between a module main body mounted to a board and outer faces of the semiconductor devices, and heat radiating plates are mounted thereto by covering outer faces of the semiconductor devices over two pieces or more of the semiconductor devices, wherein the heat conducting sheet having a heat conductivity higher than a heat conductivity of the heat conducting sheet used for the semiconductor device having a heat generating amount smaller than a heat generating amount of the semiconductor device is used for the semiconductor device having a large heat generating amount in the semiconductor devices.

REFERENCES:
patent: 5247426 (1993-09-01), Hamburgen et al.
patent: 5623394 (1997-04-01), Sherif et al.
patent: 6054198 (2000-04-01), Bunyan et al.
patent: 6212074 (2001-04-01), Gonsalves et al.
patent: 6396700 (2002-05-01), Chu et al.
patent: 6982877 (2006-01-01), Vinson et al.
patent: 7023699 (2006-04-01), Glovatsky et al.
patent: 7031162 (2006-04-01), Arvelo et al.
patent: 7193318 (2007-03-01), Colgan et al.
patent: 7221569 (2007-05-01), Tsai
patent: 7349219 (2008-03-01), Lai et al.
patent: 7365985 (2008-04-01), Ni
patent: 7375964 (2008-05-01), Lai et al.
patent: 7391613 (2008-06-01), Lai et al.
patent: 7400506 (2008-07-01), Hoss et al.
patent: 2006/0067054 (2006-03-01), Wang et al.
patent: 2007/0206360 (2007-09-01), Chu
patent: 11-163566 (1999-06-01), None
patent: 2001-196516 (2001-07-01), None
patent: 2002-134970 (2002-05-01), None
patent: WO 02/085339 (2002-10-01), None

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