Thin film transistor and method for manufacturing the same

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – On insulating substrate or layer

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C977S887000, C257SE21413, C257SE21414, C216S052000

Reexamination Certificate

active

07445971

ABSTRACT:
The present invention provides a thin-film transistor that is formed by using a patterning method capable of forming a semiconductor channel layer in sub-micron order and a method for manufacturing thereof that provides a thin-film transistor with a larger area, and suitable for mass production. These objects are achieved by a thin-film transistor formed on a substrate1with a finely processed concavoconvex surface2, in which a source electrode and a drain electrode are formed on adjacent convex portions of the concavoconvex surface2, with a channel and a gate being formed on a concave area between the convex portions. A gate electrode5, a gate insulating film6and a semiconductor channel layer7are laminated in this order on the concave area from the bottom surface of the concave portion toward the top surface. Preferably, in this thin-film transistor, the concavoconvex surface is formed of a curing resin, a semiconductor constituting a thin-film transistor is formed of a semiconductor such as polycrystal silicon or an organic semiconductor material, and the substrate is formed of glass, plastic or a composite material of these materials.

REFERENCES:
patent: 5134448 (1992-07-01), Johnsen et al.
patent: 5377031 (1994-12-01), Vu et al.
patent: 5392143 (1995-02-01), Akiyama et al.
patent: 5494837 (1996-02-01), Subramanian et al.
patent: 5642212 (1997-06-01), Yamaue et al.
patent: 5663020 (1997-09-01), Yamaue et al.
patent: 5693549 (1997-12-01), Kim
patent: 5772905 (1998-06-01), Chou
patent: 6037635 (2000-03-01), Yamazaki
patent: 6057555 (2000-05-01), Reedy et al.
patent: 6087692 (2000-07-01), Gobel et al.
patent: 6251297 (2001-06-01), Komuro et al.
patent: 6309580 (2001-10-01), Chou
patent: 6309930 (2001-10-01), Goebel et al.
patent: 6334960 (2002-01-01), Willson et al.
patent: 6365059 (2002-04-01), Pechenik
patent: 6525340 (2003-02-01), Colavito et al.
patent: 6717200 (2004-04-01), Schamberger et al.
patent: 6755984 (2004-06-01), Lee et al.
patent: 6784453 (2004-08-01), Miyazaki et al.
patent: 6847064 (2005-01-01), Zhang et al.
patent: 6933527 (2005-08-01), Isobe et al.
patent: 6949199 (2005-09-01), Gauzner et al.
patent: 6955767 (2005-10-01), Chen
patent: 2002/0151136 (2002-10-01), Lin et al.
patent: 2003/0080337 (2003-05-01), Yudasaka et al.
patent: 2003/0132482 (2003-07-01), Miyazaki et al.
patent: 2003/0183875 (2003-10-01), Isobe et al.
patent: 11-204742 (1999-07-01), None
“Recent Trend of Nanoimprint Technique.” Taniguchi et al. Journal of Japan Society of Grinding Engineers. ©2002. vol. 46, issue 6, p. 282-285.
“Low Temperature Polycrystalline Si Film Formation Technque, A Key To Realize Large-Area Highly Precise TFT Liquid Crystal Displays.” Setsuo Usul. Nikkei Business Publications, Inc. ©1999. p.117-128.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Thin film transistor and method for manufacturing the same does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Thin film transistor and method for manufacturing the same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thin film transistor and method for manufacturing the same will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4045792

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.