Semiconductor device and manufacturing method of the same

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Reexamination Certificate

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Details

C257S204000, C257S250000, C257SE27098, C438S284000

Reexamination Certificate

active

07456481

ABSTRACT:
A semiconductor device includes a first device region including a plurality of source regions and a plurality of drain regions of first conductivity type transistors, a plurality of loop-shaped gate electrode regions of the first conductivity type transistors, a second device region including a plurality of source regions and a plurality of drain regions of a second conductivity type transistors, a plurality of loop-shaped gate electrode regions of the second conductivity type transistors, a first wiring configured to supply a first voltage to at least one of the source regions of the first device region, a second wiring configured to supply a second voltage to at least one of the source regions of the second device region, and a third wiring electrically coupled to the drain regions of the first and second device regions and to the gate electrode regions of the first and the second conductivity type transistors.

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Bin Yu, et al., “FinFET Scaling to 10nm Gate Length”, International Electron Devices Meeting (IEDM) Tech. Dig., Dec. 2002, pp. 251-254.

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