Method of manufacturing an electronic device

Details Method of manufacturing an electronic device Method of manufacturing an electronic device

2006-04-27

2008-12-02

Zarneke, David A (Department: 2891)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C257SE21499

Reexamination Certificate

active

07459341

ABSTRACT:
The existing IC cards have a disadvantage of difficulty of mass production because an IC chip is supplied on a substrate one at a time. The present invention provides a method of manufacturing by placing a positioning jig having a plurality of openings each of which has a size fit with a semiconductor device, providing a plurality of semiconductor devices on said jig to house the devices into the openings, and fixing on a substrate then cutting the substrate to provide independent electronic devices. When the semiconductor device is in a form of chip, a support member attached to the chip will facilitate the handling of chips.

REFERENCES:
patent: 4063993 (1977-12-01), Burns
patent: 4417413 (1983-11-01), Hoppe et al.
patent: 4879153 (1989-11-01), Ohashi et al.
patent: 5172853 (1992-12-01), Maiwald
patent: 5238876 (1993-08-01), Takeuchi et al.
patent: 5411921 (1995-05-01), Negoro
patent: 5422163 (1995-06-01), Kamiyama et al.
patent: 5524765 (1996-06-01), Gutentag
patent: 5776796 (1998-07-01), Distefano et al.
patent: 5778529 (1998-07-01), Beilin et al.
patent: 5851854 (1998-12-01), Haghiri-Tehrani et al.
patent: 5882956 (1999-03-01), Umehara et al.
patent: 5891384 (1999-04-01), Miyajima
patent: 6013535 (2000-01-01), Moden et al.
patent: 6046499 (2000-04-01), Yano et al.
patent: 6080606 (2000-06-01), Gleskova et al.
patent: 6110806 (2000-08-01), Pogge
patent: 6147662 (2000-11-01), Grabau et al.
patent: 6156587 (2000-12-01), Kayanuma et al.
patent: 6168084 (2001-01-01), Mish
patent: 6173900 (2001-01-01), Yoshigi et al.
patent: 6184109 (2001-02-01), Sasaki et al.
patent: 6184475 (2001-02-01), Kitajima et al.
patent: 6203655 (2001-03-01), Fujikawa et al.
patent: 6214640 (2001-04-01), Fosberry et al.
patent: 6215194 (2001-04-01), Nakabayashi
patent: 6224690 (2001-05-01), Andricacos et al.
patent: 6235556 (2001-05-01), MacPherson et al.
patent: 6294822 (2001-09-01), Nakata
patent: 6297075 (2001-10-01), Odajima et al.
patent: 6303471 (2001-10-01), Unno et al.
patent: 6326233 (2001-12-01), Hashimoto
patent: 6335271 (2002-01-01), Fukuyama
patent: 6344824 (2002-02-01), Takasugi et al.
patent: 6357664 (2002-03-01), Zercher
patent: 6365433 (2002-04-01), Hyoudo et al.
patent: 6378774 (2002-04-01), Emori et al.
patent: 6402013 (2002-06-01), Abe et al.
patent: 6412701 (2002-07-01), Kohama et al.
patent: 6440773 (2002-08-01), Usami
patent: 6451623 (2002-09-01), Kawada
patent: 6460773 (2002-10-01), Kaiya et al.
patent: 6509630 (2003-01-01), Yanagisawa
patent: 6514795 (2003-02-01), Jiang et al.
patent: 6551906 (2003-04-01), Oka
patent: 6569710 (2003-05-01), Pierson
patent: 6660557 (2003-12-01), Usami
patent: 6717544 (2004-04-01), Nagasaku et al.
patent: 6731509 (2004-05-01), Okamot et al.
patent: 6797543 (2004-09-01), Kasahara et al.
patent: 6804121 (2004-10-01), Fischbach et al.
patent: 6806725 (2004-10-01), Tsui et al.
patent: 61-90272 (1986-06-01), None
patent: 10-264560 (1998-01-01), None
patent: 11-353433 (1999-12-01), None
Japanese Official Action for Application No. 2000-092950, dated Oct. 2, 2007.

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