Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate
2005-02-23
2008-11-25
Pham, Long (Department: 2814)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
C438S106000, C438S584000
Reexamination Certificate
active
07456046
ABSTRACT:
A method of producing flexible interconnections for integrated circuits, and, in particular, the forming of flexible or compliant interconnections preferably by a laser-assisted chemical vapor deposition process in semiconductor or glass substrate-based carriers which are employed for mounting and packaging multiple integrated circuit chips and selectively, other devices in the technology.
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Buchwalter Leena Paivikki
Budd Russell A.
Patel Chirag S.
International Business Machines - Corporation
Pham Long
Scully , Scott, Murphy & Presser, P.C.
Trepp, Esq. Robert M.
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