Dressing apparatus and substrate holding apparatus

Details Dressing apparatus and substrate holding apparatus Dressing apparatus and substrate holding apparatus

2006-08-07

2008-12-02

Eley, Timothy V (Department: 3724)

Abrading

Precision device or process - or with condition responsive...

With indicating

C451S021000, C451S072000, C451S443000

Reexamination Certificate

active

07458879

ABSTRACT:
A polishing apparatus for polishing a substrate comprises a polishing table having a polishing surface, and a substrate holding apparatus for holding a substrate to be polished and pressing the substrate against the polishing surface. The substrate holding apparatus comprises a vertically movable top ring body for holding a substrate, and a fluid supply source for supplying a fluid under a positive pressure or a negative pressure to a hermetically sealed chamber which is defined in the top ring body so as to control pressure under which the substrate is pressed against the polishing surface. The substrate holding apparatus further comprises a measuring device disposed in a fluid passage interconnecting the hermetically sealed chamber and the fluid supply source for measuring a flow rate of the fluid in the fluid passage.

REFERENCES:
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Patent Abstracts of Japan, vol. 1998, No. 14, Dec. 31, 1998 & JP 10 230450 A (Ebara Corp), Sep. 2, 1998.

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