Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate
2000-09-29
2008-11-11
Doan, Theresa T. (Department: 2814)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
C257S675000, C257S676000, C257S723000, C257S787000, C257SE33075, C257SE23037
Reexamination Certificate
active
07449774
ABSTRACT:
A semiconductor power module includes a lead frame having a first portion at a first level, a second portion surrounding the first portion at a second level, and a plurality of terminals connected to the second portion. The semiconductor power module further includes a power circuit mounted on a first surface of the first portion and an insulator having an electrically insulating property and thermal conductivity. The insulator is adjacent to a second surface of the first portion of the lead frame. The semiconductor power module further includes a sealer having an electrically insulating property that covers the power circuit and the control circuit.
REFERENCES:
patent: 3956726 (1976-05-01), McCarthy et al.
patent: 5031029 (1991-07-01), Acocella et al.
patent: 5057906 (1991-10-01), Ishigami
patent: 5227662 (1993-07-01), Ohno et al.
patent: 5258649 (1993-11-01), Tanaka et al.
patent: 5430331 (1995-07-01), Hamzehdoost et al.
patent: 5440169 (1995-08-01), Tomita et al.
patent: 5530295 (1996-06-01), Mehr
patent: 5635751 (1997-06-01), Ikeda et al.
patent: 5703399 (1997-12-01), Majumdar et al.
patent: 6191478 (2001-02-01), Chen
patent: 6239487 (2001-05-01), Park et al.
patent: 6281574 (2001-08-01), Drake et al.
patent: 6432750 (2002-08-01), Jeon et al.
patent: 6471822 (2002-10-01), Yin et al.
patent: 69614195 (2002-04-01), None
patent: 5-294744 (1993-11-01), None
patent: 05299576 (1993-11-01), None
patent: 6-37250 (1993-12-01), None
patent: 6-291362 (1994-10-01), None
patent: 8-204120 (1996-08-01), None
patent: 9-102580 (1997-04-01), None
patent: 9 139461 (1997-05-01), None
patent: 10093015 (1998-04-01), None
patent: 2000-138342 (2000-05-01), None
Jeun Gi-Young
Jeun O-Seob
Lee Eun-Ho
Lim Seung-Won
Doan Theresa T.
Fairchild Korea Semiconductor Ltd.
Marshall & Gerstein & Borun LLP
Nguyen Dilinh
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