Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With microwave gas energizing means
Reexamination Certificate
2005-03-25
2008-11-04
Alejandro, Luz L. (Department: 1763)
Adhesive bonding and miscellaneous chemical manufacture
Differential fluid etching apparatus
With microwave gas energizing means
C118S7230MW, C315S111210
Reexamination Certificate
active
07445690
ABSTRACT:
A plasma processing apparatus includes a chamber for containing a substrate to be processed, a gas supply unit for supplying a processing gas into the chamber, and a microwave introducing unit for introducing plasma generating microwaves into the chamber. The microwave introducing unit includes a microwave oscillator for outputting a plurality if microwaves having specified outputs, and an antenna section having a plurality of antennas to which the microwaves outputted from the microwave oscillator are respectively transmitted.
REFERENCES:
patent: 3912546 (1975-10-01), Hunsperger et al.
patent: 5874706 (1999-02-01), Ishii et al.
patent: 6080270 (2000-06-01), Tabrez et al.
patent: 6325018 (2001-12-01), Hongoh
patent: 2004/0031288 (2004-02-01), Blinov
patent: 1110801 (2001-09-01), None
patent: 8-337887 (1996-12-01), None
patent: 9-102400 (1997-04-01), None
patent: 11-274874 (1999-10-01), None
patent: 2001-257098 (2001-09-01), None
patent: 2002-50615 (2002-02-01), None
patent: 2002-260899 (2002-09-01), None
Kasai Shigeru
Ogino Takashi
Osada Yuki
Alejandro Luz L.
Oblon, Spivak, McCelland, Maier & Neustadt, P.C.
Tokyo Electron Limited
LandOfFree
Plasma processing apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Plasma processing apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Plasma processing apparatus will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4027063