Method of fabricating micro-needle array

Semiconductor device manufacturing: process – Chemical etching – Vapor phase etching

Reexamination Certificate

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C257SE21273

Reexamination Certificate

active

07456112

ABSTRACT:
A method of fabricating a micro-needle array is provided. The method of fabricating a micro-needle array having a substrate having a first surface and a second surface spaced in a predetermined interval apart from the first surface, includes patterning on the first surface, thereby forming a shape of micro-needle bodies. Further, micro-passageways are formed that penetrate the first surface of the substrate from the second surface by a porous silicon process, and integrates the micro-passageways, thereby forming the bodies and channels of micro-needles.

REFERENCES:
patent: 6503231 (2003-01-01), Prausnitz et al.
patent: 2005/0011858 (2005-01-01), Kuo et al.
patent: 2006/0015061 (2006-01-01), Kuo et al.

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