Semiconductor device and method for manufacturing the same

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Reexamination Certificate

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Details

C257S333000, C257S336000, C257S342000, C257S407000, C257S408000, C257S492000, C257S493000, C257SE29027, C257SE29066, C257SE29197, C257SE29256, C257SE29268

Reexamination Certificate

active

07408234

ABSTRACT:
An object of the present invention is to provide a semiconductor device that is able to realize a low on-resistance maintaining a high drain-to-source breakdown voltage, and a method for manufacturing thereof, the present invention including: a supporting substrate; a semiconductor layer having a P−type active region that is formed on the supporting substrate, interposing a buried oxide film between the semiconductor layer and the supporting substrate; and a gate electrode that is formed on the semiconductor layer, interposing a gate oxide film and a part of a LOCOS film between the gate electrode and the semiconductor layer, wherein the P−type active region has: an N+type source region; a P type body region; a P+type back gate contact region; an N type drain offset region; an N+type drain contact region; and an N type drain buffer region that is formed in a limited region between the N type drain offset region and the P type body region, and the N type drain buffer region is in contact with a source side end of the LOCOS film and is shallower than the N type drain offset region.

REFERENCES:
patent: 6258674 (2001-07-01), Kwon et al.
patent: 6380566 (2002-04-01), Matsudai et al.
patent: 6599782 (2003-07-01), Kikuchi et al.
patent: 2004/0238913 (2004-12-01), Kwon et al.
patent: 2001-102586 (2001-04-01), None

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