Microfeature devices and methods for manufacturing...

Details Microfeature devices and methods for manufacturing... Microfeature devices and methods for manufacturing...

2006-04-20

2008-08-12

Zameke, David A (Department: 2891)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

C257S778000, C257S781000, C257SE23023, C257SE23026

Reexamination Certificate

active

07411297

ABSTRACT:
Microfeature devices, microfeature workpieces, and methods for manufacturing microfeature devices and microfeature workpieces are disclosed herein. The microfeature workpieces have an integrated circuit, a surface, and a plurality of interconnect elements projecting from the surface and arranged in arrays on the surface. In one embodiment, a method includes forming a coating on the interconnect elements of the microfeature workpiece, producing a layer over the surface of the microfeature workpiece after forming the coating, and removing the coating from at least a portion of the individual interconnect elements. The coating has a surface tension less than a surface tension of the interconnect elements to reduce the extent to which the material in the layer wicks up the interconnect elements and produces a fillet at the base of the individual interconnect elements.

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