Packaging of a microchip device

Details Packaging of a microchip device Packaging of a microchip device

2002-06-19

2008-10-28

Thai, Luan (Department: 2891)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Wire contact, lead, or bond

C257S782000, C257S783000, C257S780000, C257S781000, C257S737000, C257S738000, C257SE23021, C257SE23069, C438S106000, C438S107000, C438S110000, C438S125000, C438S126000, C438S127000

Reexamination Certificate

active

07443041

ABSTRACT:
A method of packaging a microchip device, an interposer for packaging, and a packaged microchip device. An interposer is placed on microchip devices. The interposer includes an aperture which extends from the interposer surface where external electrical contacts are located on the surface of the microchip devices. Electrical contacts on the microchip device surface are accessible through the aperture in order to electrically connect the electrical contacts with the external electrical contacts of the interposer. The aperture is divided into at least two openings or aperture regions, separated by a bridge. This facilitates the handling of the interposer.

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