Sproutless pre-packaged molding for component encapsulation

Details Sproutless pre-packaged molding for component encapsulation Sproutless pre-packaged molding for component encapsulation

1996-05-06

1999-06-15

Davis, Robert

Plastic article or earthenware shaping or treating: apparatus

Distinct means to feed, support or manipulate preform stock...

Opposed registering coacting female molds

26427217, 2643285, 425544, 425588, B29C 4502

Patent

active

059120240

ABSTRACT:
A method and apparatus for encapsulating an integrated circuit die and leadframe assembly. A prepackaged sproutless mold compound insert 71 is placed in a rectangular receptacle 91 in a bottom mold chase 81. The receptacle is coupled to a plurality of die cavities 85 by runners 87. Leadframe strip assemblies containing leadframes, integrated circuit dies, and bond wires coupling the leadframes and dies are placed over the bottom mold chase 81 such that the integrated circuit dies are each centered over a bottom mold die cavity 85. A top mold chase 90 is placed over the bottom mold chase 81 and the mold compound package 71. The top mold chase 90 has die cavities 95 corresponding to those in the bottom mold chase 81. The mold compound insert 71 is preferably packaged in a plastic film 75 which has heat sealed edges 77. The mold compound is forced through the package 75 and heat seals 77 during the molding process by the pressure applied by a rectangular plunger 101. The sproutless mold compound insert is packaged so that the mold compound will exit the packaging only where runners intersect the receptacle. The sproutless mold compound insert requires no alignment or cutting tools within the mold station. The plunger is applied using variable speed and pressure to control the rate the mold compound fills the cavities in the top and bottom mold chases, thereby avoiding voids in the completed packages and minimizing wire sweep of the bond wires of the integrated circuit assemblies.

REFERENCES:
patent: H1654 (1997-06-01), Rounds
patent: 4983110 (1991-01-01), Yoshida et al.
patent: 5043199 (1991-08-01), Kubota et al.
patent: 5071334 (1991-12-01), Obara
patent: 5098626 (1992-03-01), Pas
patent: 5108278 (1992-04-01), Tsutsumi et al.
patent: 5302101 (1994-04-01), Nishimura
patent: 5431854 (1995-07-01), Pas
patent: 5435953 (1995-07-01), Osada et al.

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