Method for solder bumping, and solder-bumping structures...

Details Method for solder bumping, and solder-bumping structures... Method for solder bumping, and solder-bumping structures...

2004-12-09

2008-08-12

Nguyen, Cuong Q (Department: 2811)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C438S637000, C438S640000

Reexamination Certificate

active

07410824

ABSTRACT:
A method for solder bumping provides a substrate and forms a film on the substrate. The film has openings therethrough. A stencil is aligned on the film. The stencil has openings therethrough over the openings through the film. Solder paste is printed onto the substrate and into the openings through the stencil and the openings through the film. The solder paste is reflowed to form solder balls therefrom. The stencil and the film are then removed.

REFERENCES:
patent: 5024372 (1991-06-01), Altman et al.
patent: 6316289 (2001-11-01), Chung
patent: 6592943 (2003-07-01), Chan et al.
patent: 6756184 (2004-06-01), Peng et al.
patent: 6759319 (2004-07-01), Viswanadam et al.
patent: 2002/0173134 (2002-11-01), Viswanadam et al.

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