Photoresist undercoat-forming material and patterning process

Details Photoresist undercoat-forming material and patterning process Photoresist undercoat-forming material and patterning process

2005-07-14

2008-08-26

Walke, Amanda C. (Department: 1795)

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Radiation sensitive composition or product or process of making

C430S311000, C430S313000, C430S317000, C524S548000, C524S549000, C526S267000

Reexamination Certificate

active

07416833

ABSTRACT:
An undercoat-forming material comprising a copolymer derived from an indene and a compound having a hydroxyl or epoxy group and a double bond, an organic solvent, an acid generator, and a crosslinker, optionally combined with an intermediate layer having an antireflective effect, has an absorptivity coefficient sufficient to provide an antireflective effect at a thickness of at least 200 nm and a high etching resistance as demonstrated by slow etching rates with CF4/CHF3and Cl2/BCl3gases for substrate processing.

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