Methods of making microelectronic packages

Details Methods of making microelectronic packages Methods of making microelectronic packages

2005-08-04

2008-08-19

Clark, S. V (Department: 2823)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C438S455000

Reexamination Certificate

active

07413926

ABSTRACT:
A method of making a microelectronic package includes providing a first substrate having a top surface, providing a second substrate having a top surface including a plurality of conductive pads, a bottom surface remote therefrom and an opening extending between the top and bottom surfaces, and securing the second substrate over the first substrate so that the bottom surface of the second substrate confronts the top surface of the first substrate, wherein the first and second substrates have coefficients of thermal expansion that are substantially similar to one another. The method also includes placing a microelectronic element having a front face with contacts and a back face remote therefrom in the opening of the second substrate and securing the microelectronic element over the first substrate so that the back face of the microelectronic element confronts the top surface of the first substrate, and electrically interconnecting the contacts of the microelectronic element with the conductive pads of the second substrate.

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