Method of forming plug of semiconductor device

Details Method of forming plug of semiconductor device Method of forming plug of semiconductor device

2004-12-30

2008-10-28

Everhart, Caridad M (Department: 2891)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C257SE21226, C438S653000

Reexamination Certificate

active

07442639

ABSTRACT:
A method for forming a plug of a semiconductor device according to a preferred embodiment includes forming a metal wiring on a semiconductor substrate, forming an interlayer dielectric layer on the semiconductor substrate having the metal wiring, forming a contact hole for partially exposing the metal wiring by selectively etching the interlayer dielectric layer, annealing the semiconductor substrate having the contact hole using NH3gas, plasma processing the annealed semiconductor substrate using the NH3, and forming a barrier layer on the interlayer dielectric layer having the contact hole.

REFERENCES:
patent: 6069073 (2000-05-01), Kim et al.
patent: 6531389 (2003-03-01), Shue et al.
patent: 6562416 (2003-05-01), Ngo et al.
patent: 6703708 (2004-03-01), Werkhoven et al.
patent: 6893953 (2005-05-01), Hoshino et al.
patent: 2002/0127840 (2002-09-01), Smith et al.
patent: 2002/0162736 (2002-11-01), Ngo et al.
patent: 2004/0063310 (2004-04-01), Ngo et al.
patent: 2005/0009325 (2005-01-01), Chung et al.
patent: 2005/0159012 (2005-07-01), Ohto et al.
patent: 07-273120 (1995-10-01), None

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