Metal oxynitride as a pFET material

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Reexamination Certificate

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C257S410000, C257S412000

Reexamination Certificate

active

07436034

ABSTRACT:
A compound metal comprising MOxNywhich is a p-type metal having a workfunction of about 4.75 to about 5.3, preferably about 5, eV that is thermally stable on a gate stack comprising a high k dielectric and an interfacial layer is provided as well as a method of fabricating the MOxNycompound metal. Furthermore, the MOxNymetal compound of the present invention is a very efficient oxygen diffusion barrier at 1000° C. allowing very aggressive equivalent oxide thickness (EOT) and inversion layer thickness scaling below 14 Å in a p-metal oxide semiconductor (PMOS) device. In the above formula, M is a metal selected from Group IVB, VB, VIB or VIIB of the Periodic Table of Elements, x is from about 5 to about 40 atomic % and y is from about 5 to about 40 atomic %.

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Cartier, E. et al., “Systematic Study of pFET VtWith Hf-Based Gate Stacks With Poly-Si and FUSI Gates.” IEEE, p. 44-45, (2004).
Gusev, E. P. et al., “Advanced Gate Stacks With Fully Silicided (FUSI) Gates and High-k Dielectrics: Enhanced Performance at Reduced Gate Leakage.” IEEE p. 79-82 (2004).

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