Semiconductor device and fabrication method for the same

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Reexamination Certificate

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C257S059000, C257S072000, C257S352000, C438S401000

Reexamination Certificate

active

07436027

ABSTRACT:
In a semiconductor device including a monocrystalline thin film transistor16athat has been formed on a monocrystalline Si wafer100and then is transferred to a insulating substrate2, LOCOS oxidization is performed with respect to the element-isolation region of the monocrystalline Si wafer100so as to create a field oxide film (SiO2film)104, and a marker107is formed on the field oxide film104. With this structure, alignment of components may be performed based on a gate electrode106upon or after the transfer step.

REFERENCES:
patent: 4321747 (1982-03-01), Takemura et al.
patent: 4829018 (1989-05-01), Wahlstrom
patent: 5102819 (1992-04-01), Matsushita et al.
patent: 5266511 (1993-11-01), Takao
patent: 5892256 (1999-04-01), Matsushita et al.
patent: 6166438 (2000-12-01), Davidson
patent: 6329265 (2001-12-01), Miyawaki et al.
patent: 6355501 (2002-03-01), Fung et al.
patent: 6368936 (2002-04-01), Yoshida
patent: 6420791 (2002-07-01), Huang et al.
patent: 7205204 (2007-04-01), Ogawa et al.
patent: 2002/0187572 (2002-12-01), Dai et al.
patent: 0 684 643 (1995-11-01), None
patent: 2 300 518 (1996-11-01), None
patent: 02-060163 (1990-02-01), None
patent: 05-275665 (1993-10-01), None
patent: 2743391 (1998-02-01), None
patent: 11-024106 (1999-01-01), None
patent: 3141486 (2000-12-01), None
patent: 3278944 (2002-02-01), None
patent: 2002-244587 (2002-08-01), None
patent: 2003-031780 (2003-01-01), None
patent: 2003-282885 (2003-10-01), None
patent: 95/09438 (1995-04-01), None
U.S. Appl. No. 10/963,817, filed Oct. 14, 2004.
European Search Report mailed Mar. 15, 2006 in corresponding EP application No. 04256543.2.
“IR Alignment of Two or More Opaque Silicon Wafers”, IBM Technical Disclosure Bulletin, IBM Corp., New York, vol. 22, No. 2, Jul. 1979, pp. 841-843.

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