Semiconductor device and manufacturing method thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Non-single crystal – or recrystallized – semiconductor... – Amorphous semiconductor material

Reexamination Certificate

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C257S072000

Reexamination Certificate

active

07442957

ABSTRACT:
The invention relates to a semiconductor device including a plurality of thin film transistors provided on a base member having a curved surface. The surface may be bent in either a convex shape or a concave shape. All channel length directions of the plurality of thin film transistors may also be aligned in the same direction. Further, the channel length direction may be different from the direction in which the base member is bent. A pixel portion and a driver circuit portion may also be provided on the base member. The invention also includes a method of manufacturing a semiconductor device including forming a layer to be peeled including an element of a substrate, bonding a support member to the layer to be peeled, and bonding a transfer body to the layer to be peeled.

REFERENCES:
patent: 4722765 (1988-02-01), Ambros et al.
patent: 4883561 (1989-11-01), Gmitter et al.
patent: 5206749 (1993-04-01), Zavracky et al.
patent: 5258325 (1993-11-01), Spitzer et al.
patent: 5273475 (1993-12-01), Oshikawa
patent: 5317236 (1994-05-01), Zavracky et al.
patent: 5341015 (1994-08-01), Kohno
patent: 5376561 (1994-12-01), Vu et al.
patent: 5397713 (1995-03-01), Hamamoto et al.
patent: 5650363 (1997-07-01), Endroes et al.
patent: 5654811 (1997-08-01), Spitzer et al.
patent: 5674304 (1997-10-01), Fukada et al.
patent: 5757456 (1998-05-01), Yamazaki et al.
patent: 5781164 (1998-07-01), Jacobsen et al.
patent: 5807440 (1998-09-01), Kubota et al.
patent: 5817548 (1998-10-01), Noguchi et al.
patent: 5821138 (1998-10-01), Yamazaki et al.
patent: 5834327 (1998-11-01), Yamazaki et al.
patent: 5851862 (1998-12-01), Ohtani et al.
patent: 5879741 (1999-03-01), Itoh
patent: 5929961 (1999-07-01), Nishi et al.
patent: 5943593 (1999-08-01), Noguchi et al.
patent: 6020271 (2000-02-01), Yanagida
patent: 6027958 (2000-02-01), Vu et al.
patent: 6033974 (2000-03-01), Henley et al.
patent: 6043800 (2000-03-01), Spitzer et al.
patent: 6059913 (2000-05-01), Asmussen et al.
patent: 6096581 (2000-08-01), Zhang et al.
patent: 6100166 (2000-08-01), Sakaguchi et al.
patent: 6118502 (2000-09-01), Yamazaki et al.
patent: 6127199 (2000-10-01), Inoue et al.
patent: 6133071 (2000-10-01), Nagai
patent: 6140980 (2000-10-01), Spitzer et al.
patent: 6190937 (2001-02-01), Nakagawa et al.
patent: 6221738 (2001-04-01), Sakaguchi et al.
patent: 6258666 (2001-07-01), Mizutani et al.
patent: 6261634 (2001-07-01), Itoh
patent: 6268695 (2001-07-01), Affinito
patent: 6310362 (2001-10-01), Takemura
patent: 6320640 (2001-11-01), Nishi et al.
patent: 6340641 (2002-01-01), Muraguchi et al.
patent: 6362866 (2002-03-01), Yamazaki et al.
patent: 6372608 (2002-04-01), Shimoda et al.
patent: 6376333 (2002-04-01), Yamazaki et al.
patent: 6391220 (2002-05-01), Zhang et al.
patent: 6420283 (2002-07-01), Ogawa et al.
patent: 6423614 (2002-07-01), Doyle
patent: 6429095 (2002-08-01), Sakaguchi et al.
patent: 6448152 (2002-09-01), Henley et al.
patent: 6455397 (2002-09-01), Belford
patent: 6486041 (2002-11-01), Henley et al.
patent: 6492026 (2002-12-01), Graff et al.
patent: 6506664 (2003-01-01), Beyne et al.
patent: 6521511 (2003-02-01), Inoue et al.
patent: 6544430 (2003-04-01), McCormack et al.
patent: 6572780 (2003-06-01), McCormack et al.
patent: 6582996 (2003-06-01), Hara et al.
patent: 6627518 (2003-09-01), Inoue et al.
patent: 6645830 (2003-11-01), Shimoda et al.
patent: 6664169 (2003-12-01), Iwasaki et al.
patent: 6664730 (2003-12-01), Weaver
patent: 6682990 (2004-01-01), Iwane et al.
patent: RE38466 (2004-03-01), Inoue et al.
patent: 6700631 (2004-03-01), Inoue et al.
patent: 6707160 (2004-03-01), Yamaji
patent: 6737285 (2004-05-01), Iketani et al.
patent: 6774010 (2004-08-01), Chu et al.
patent: 6781152 (2004-08-01), Yamazaki
patent: 6784113 (2004-08-01), Hembree
patent: 6790747 (2004-09-01), Henley et al.
patent: 6802926 (2004-10-01), Mizutani et al.
patent: 6814832 (2004-11-01), Utsunomiya
patent: 6815240 (2004-11-01), Hayashi
patent: 6818530 (2004-11-01), Shimoda et al.
patent: 6821553 (2004-11-01), Miyashita et al.
patent: 6833156 (2004-12-01), Miyashita et al.
patent: 6838192 (2005-01-01), Miyashita et al.
patent: 6863961 (2005-03-01), Miyashita et al.
patent: 6875671 (2005-04-01), Faris
patent: 6878607 (2005-04-01), Inoue et al.
patent: 6885389 (2005-04-01), Inoue et al.
patent: 7094665 (2006-08-01), Shimoda et al.
patent: 7180091 (2007-02-01), Yamazaki et al.
patent: 2001/0001050 (2001-05-01), Miyashita et al.
patent: 2001/0004121 (2001-06-01), Sakama et al.
patent: 2001/0022362 (2001-09-01), Hayashi et al.
patent: 2001/0040645 (2001-11-01), Yamazaki
patent: 2002/0004250 (2002-01-01), Iketani et al.
patent: 2002/0004292 (2002-01-01), Yamazaki et al.
patent: 2002/0030189 (2002-03-01), Ishikawa
patent: 2002/0041926 (2002-04-01), Miyashita et al.
patent: 2002/0048864 (2002-04-01), Yamazaki et al.
patent: 2002/0106522 (2002-08-01), McCormack et al.
patent: 2002/0117256 (2002-08-01), McCormack et al.
patent: 2002/0136823 (2002-09-01), Miyashita et al.
patent: 2002/0146893 (2002-10-01), Shimoda et al.
patent: 2002/0155215 (2002-10-01), Miyashita et al.
patent: 2003/0008437 (2003-01-01), Inoue et al.
patent: 2003/0024635 (2003-02-01), Utsunomiya
patent: 2003/0025118 (2003-02-01), Yamazaki et al.
patent: 2003/0025146 (2003-02-01), Narwankar et al.
patent: 2003/0032210 (2003-02-01), Takayama et al.
patent: 2003/0040164 (2003-02-01), Inoue et al.
patent: 2003/0047280 (2003-03-01), Takayama et al.
patent: 2003/0047732 (2003-03-01), Yamazaki et al.
patent: 2003/0054186 (2003-03-01), Miyashita et al.
patent: 2003/0059990 (2003-03-01), Yamazaki
patent: 2003/0062845 (2003-04-01), Yamazaki et al.
patent: 2003/0064569 (2003-04-01), Takayama et al.
patent: 2003/0075733 (2003-04-01), Yamazaki et al.
patent: 2003/0082889 (2003-05-01), Maruyama et al.
patent: 2003/0100169 (2003-05-01), Tanaka et al.
patent: 2003/0162312 (2003-08-01), Takayama et al.
patent: 2003/0224582 (2003-12-01), Shimoda et al.
patent: 2004/0087110 (2004-05-01), Takayama et al.
patent: 2004/0106237 (2004-06-01), Yamazaki
patent: 2004/0219762 (2004-11-01), Shimoda et al.
patent: 2005/0017255 (2005-01-01), Yamazaki
patent: 2005/0042477 (2005-02-01), Miyashita et al.
patent: 1212114 (1999-03-01), None
patent: 1231065 (1999-10-01), None
patent: 0858110 (1998-08-01), None
patent: 0880303 (1998-11-01), None
patent: 0924769 (1999-06-01), None
patent: 0951057 (1999-10-01), None
patent: 1014452 (2000-06-01), None
patent: 1122794 (2001-08-01), None
patent: 1211916 (2002-06-01), None
patent: 1351308 (2003-10-01), None
patent: 1376716 (2004-01-01), None
patent: 1376717 (2004-01-01), None
patent: 05-090623 (1993-04-01), None
patent: 05-347186 (1993-12-01), None
patent: 06-214220 (1994-08-01), None
patent: 07-142570 (1995-06-01), None
patent: 10-125929 (1998-05-01), None
patent: 10-125930 (1998-05-01), None
patent: 10-125931 (1998-05-01), None
patent: 11-087799 (1999-03-01), None
patent: 11-135882 (1999-05-01), None
patent: 2001-085154 (2001-03-01), None
patent: 2001-166301 (2001-06-01), None
patent: 2001-189460 (2001-07-01), None
patent: 2001-267578 (2001-09-01), None
patent: 3238223 (2001-12-01), None
patent: 2002-184959 (2002-06-01), None
patent: 2002-328624 (2002-11-01), None
patent: 2003-142666 (2003-05-01), None
patent: WO 92/12453 (1992-07-01), None
patent: WO-98/21750 (1998-05-01), None
patent: WO-99/44242 (1999-09-01), None
patent: WO 00/46854 (2000-08-01), None
Webster's New World Dictionary of American English, Third College Edition, Victoria Neufeldt et al., Jan. 1, 1988, p. 1479.
Takayama et al., “A CPU on a Plastic Film Substrate”, 2004 Symposium on VLSI Technology : Digest of Technical Papers, Jun. 15, 2004, pp. 230-231.

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