Thermally isolated membrane structure

Details Thermally isolated membrane structure Thermally isolated membrane structure

2005-11-16

2008-05-13

Smith, Zandra V. (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Responsive to non-electrical signal

Physical deformation

C257S414000, C257S415000, C257S418000

Reexamination Certificate

active

07372115

ABSTRACT:
An MEMS device including a semiconductor substrate having an upper and lower surface, and a support structure disposed at least partially in the semiconductor substrate. The support structure includes a plurality of support members oriented to define a plurality of cells in the semiconductor substrate. A thermally isolated membrane is disposed above the upper surface of the semiconductor substrate and is supported by the support structure. At least one functional component is mounted to the membrane. The plurality of cells are located substantially beneath the at least one functional component.

REFERENCES:
patent: 5867302 (1999-02-01), Fleming
patent: 6573734 (2003-06-01), He et al.
patent: 6800912 (2004-10-01), Ozgur
patent: 6942750 (2005-09-01), Chou et al.
patent: 7075161 (2006-07-01), Barth
patent: 2002/0195673 (2002-12-01), Chou et al.
patent: 2005/0101047 (2005-05-01), Freeman et al.
patent: 2005/0146247 (2005-07-01), Fisher et al.
patent: 2005/0206048 (2005-09-01), Ryu et al.

Affiliated with

Also associated with

Rating

Thermally isolated membrane structure does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Thermally isolated membrane structure, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thermally isolated membrane structure will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3984948