Method for hermetically housing optical components, and...

Active solid-state devices (e.g. – transistors – solid-state diode – Incoherent light emitter structure – With housing or contact structure

Reexamination Certificate

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Details

C257S680000, C257SE23023, C438S026000, C438S064000

Reexamination Certificate

active

07368758

ABSTRACT:
A method is provided for producing a housing body for optoelectronic components that are reliable and inexpensive. The method creates a hermetic joint between a metal sleeve and a glass pane by joining together a housing element and a preferably metallic housing arrangement. The housing element and the housing arrangement are brought into contact with a glass solder, before the housing element and housing arrangement are joined. The glass solder is applied as a shapeable material, in particular as a paste. The glass solder is pre-vitrified and has its shape fixed by energy being introduced at least once, in particular as a result of organic constituents being burnt off. After the housing element has been inserted into the housing arrangement, a joint that is hermetic at least in regions, is produced between the glass pane and housing arrangement.

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patent: WO01/99101 (2000-12-01), None

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