Semiconductor device packaging substrate and semiconductor...

Details Semiconductor device packaging substrate and semiconductor... Semiconductor device packaging substrate and semiconductor...

2006-06-08

2008-05-20

Nguyen, Cuong Q (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Flip chip

C257S687000, C257SE23021

Reexamination Certificate

active

07375433

ABSTRACT:
A packaging substrate for a semiconductor device includes: a solder resist on a surface of the packaging substrate, the solder resist having a first opening portion for mounting the semiconductor device; and a speed adjusting opening portion for adjusting a flow speed of an underfill resin when the underfill resin is provided, the adjusting section being positioned in vicinity of the first opening portion of the solder resist.

REFERENCES:
patent: 6815831 (2004-11-01), Dias
patent: 2007/0257362 (2007-11-01), Karashima et al.
patent: 2002-329744 (2002-11-01), None

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