Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate
2006-03-31
2008-09-30
Chambliss, Alonzo (Department: 2892)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Multiple housings
C257S784000, C257S787000, C361S764000, C361S776000
Reexamination Certificate
active
07429786
ABSTRACT:
A semiconductor package subassembly includes a die affixed to, and electrically interconnected with, a die attach side of a first package substrate, and a second substrate having a first side and a second (“land”) side, mounted over the first package with the first side of the second substrate facing the die attach side of the first package substrate, and supported by a spacer or a spacer assembly. Z-interconnection of the package and the substrate is by wire bonds connecting the first and second substrates. The assembly is encapsulated in such a way that both the land side of the second substrate (one side of the assembly) and a portion of the land side of the first package substrate (on the opposite side of the assembly) are exposed, so that second level interconnection and interconnection with additional components may be made.
REFERENCES:
patent: 5222014 (1993-06-01), Lin
patent: 5229960 (1993-07-01), De Givry
patent: 5340771 (1994-08-01), Rostoker
patent: 5373189 (1994-12-01), Massit et al.
patent: 5436203 (1995-07-01), Lin
patent: 5444296 (1995-08-01), Kaul et al.
patent: 5495398 (1996-02-01), Takiar et al.
patent: 5550711 (1996-08-01), Burns et al.
patent: 5652185 (1997-07-01), Lee
patent: 5744863 (1998-04-01), Culnane et al.
patent: 5898219 (1999-04-01), Barrow
patent: 5899705 (1999-05-01), Akram
patent: 5903049 (1999-05-01), Mori
patent: 5977640 (1999-11-01), Bertin et al.
patent: 5982633 (1999-11-01), Jeansonne
patent: 5994166 (1999-11-01), Akram et al.
patent: 6025648 (2000-02-01), Takahashi et al.
patent: 6034875 (2000-03-01), Heim et al.
patent: 6075289 (2000-06-01), Distefano
patent: 6083775 (2000-07-01), Huang et al.
patent: 6118176 (2000-09-01), Tao et al.
patent: 6133626 (2000-10-01), Hawke et al.
patent: 6157080 (2000-12-01), Tamaki et al.
patent: 6165815 (2000-12-01), Ball
patent: 6201266 (2001-03-01), Ohuchi et al.
patent: 6201302 (2001-03-01), Tzu
patent: 6238949 (2001-05-01), Nguyen et al.
patent: 6265766 (2001-07-01), Moden
patent: 6274930 (2001-08-01), Vaiyapuri et al.
patent: 6316838 (2001-11-01), Ozawa et al.
patent: 6333552 (2001-12-01), Kakimoto et al.
patent: 6340846 (2002-01-01), LoBianco et al.
patent: 6376904 (2002-04-01), Haba et al.
patent: 6388313 (2002-05-01), Lee et al.
patent: 6400007 (2002-06-01), Wu et al.
patent: 6407456 (2002-06-01), Ball
patent: 6413798 (2002-07-01), Asada
patent: 6414381 (2002-07-01), Takeda
patent: 6424050 (2002-07-01), Komiyama
patent: 6441496 (2002-08-01), Chen et al.
patent: 6445064 (2002-09-01), Ishii et al.
patent: 6462421 (2002-10-01), Hsu et al.
patent: 6472732 (2002-10-01), Terui
patent: 6489676 (2002-12-01), Taniguchi et al.
patent: 6492726 (2002-12-01), Quek et al.
patent: 6501165 (2002-12-01), Farnworth
patent: 6509639 (2003-01-01), Lin
patent: 6512303 (2003-01-01), Moden
patent: 6538319 (2003-03-01), Terui
patent: 6545365 (2003-04-01), Kondo et al.
patent: 6545366 (2003-04-01), Michii et al.
patent: 6552423 (2003-04-01), Song et al.
patent: 6555902 (2003-04-01), Lo et al.
patent: 6555917 (2003-04-01), Heo
patent: 6570249 (2003-05-01), Liao et al.
patent: 6583503 (2003-06-01), Akram et al.
patent: 6590281 (2003-07-01), Wu et al.
patent: 6593647 (2003-07-01), Ichikawa
patent: 6593648 (2003-07-01), Emoto
patent: 6593662 (2003-07-01), Pu et al.
patent: 6599779 (2003-07-01), Shim et al.
patent: 6607937 (2003-08-01), Corisis
patent: 6611063 (2003-08-01), Ichinose et al.
patent: 6621169 (2003-09-01), Kikuma et al.
patent: 6621172 (2003-09-01), Nakayama et al.
patent: 6649448 (2003-11-01), Tomihara
patent: 6650019 (2003-11-01), Glenn et al.
patent: 6667556 (2003-12-01), Moden
patent: 6690089 (2004-02-01), Uchida
patent: 6700178 (2004-03-01), Chen et al.
patent: 6706557 (2004-03-01), Koopmans
patent: 6716670 (2004-04-01), Chiang
patent: 6734539 (2004-05-01), Degani et al.
patent: 6734552 (2004-05-01), Combs et al.
patent: 6737750 (2004-05-01), Hoffman et al.
patent: 6746894 (2004-06-01), Fee et al.
patent: 6747361 (2004-06-01), Ichinose
patent: 6762488 (2004-07-01), Maeda et al.
patent: 6777799 (2004-08-01), Kikuma et al.
patent: 6777819 (2004-08-01), Huang
patent: 6787915 (2004-09-01), Uchida et al.
patent: 6787916 (2004-09-01), Halahan
patent: 6794741 (2004-09-01), Lin et al.
patent: 6794749 (2004-09-01), Akram
patent: 6818980 (2004-11-01), Perdon, Jr.
patent: 6828665 (2004-12-01), Pu et al.
patent: 6835598 (2004-12-01), Baek et al.
patent: 6838761 (2005-01-01), Karnezos
patent: 6847105 (2005-01-01), Koopmans
patent: 6861288 (2005-03-01), Shim et al.
patent: 6864566 (2005-03-01), Choi, III
patent: 6882057 (2005-04-01), Hsu
patent: 6890798 (2005-05-01), McMahon
patent: 6900528 (2005-05-01), Mess et al.
patent: 6906415 (2005-06-01), Jiang et al.
patent: 6906416 (2005-06-01), Karnezos
patent: 6930378 (2005-08-01), St. Amand et al.
patent: 6930396 (2005-08-01), Kurita et al.
patent: 6933598 (2005-08-01), Karnezos
patent: 6951982 (2005-10-01), Chye et al.
patent: 6972481 (2005-12-01), Karnezos
patent: 7034387 (2006-04-01), Karnezos
patent: 7034388 (2006-04-01), Yang et al.
patent: 7045887 (2006-05-01), Karnezos
patent: 7049691 (2006-05-01), Karnezos
patent: 7053476 (2006-05-01), Karnezos
patent: 7053477 (2006-05-01), Karnezos
patent: 7057269 (2006-06-01), Karnezos
patent: 7061088 (2006-06-01), Karnezos
patent: 7064426 (2006-06-01), Karnezos
patent: 7071568 (2006-07-01), St. Amand et al.
patent: 7081678 (2006-07-01), Tsai
patent: 7101731 (2006-09-01), Karnezos
patent: 7119427 (2006-10-01), Kim
patent: 2002/0096755 (2002-07-01), Fukui et al.
patent: 2002/0130404 (2002-09-01), Ushijima et al.
patent: 2003/0113952 (2003-06-01), Sambasivam et al.
patent: 2003/0153134 (2003-08-01), Kawata et al.
patent: 2004/0016939 (2004-01-01), Akiba et al.
patent: 2004/0061213 (2004-04-01), Karnezos
patent: 2004/0201087 (2004-10-01), Lee
patent: 2004/0212096 (2004-10-01), Wang
patent: 2006/0043556 (2006-03-01), Su et al.
patent: 2006/0138631 (2006-06-01), Tao et al.
patent: 2006/0189033 (2006-08-01), Kim
patent: 2006/0197209 (2006-09-01), Choi et al.
patent: 2006/0244157 (2006-11-01), Carson
patent: 0 430 458 (1991-06-01), None
patent: 0 652 630 (1995-05-01), None
patent: 05152505 (1993-06-01), None
patent: 2001223326 (2001-08-01), None
patent: 20010688614 (2001-07-01), None
patent: 2004085348 (2004-10-01), None
patent: WO 98/50954 (1998-11-01), None
patent: WO 02/084716 (2002-10-01), None
patent: WO 03/032370 (2003-04-01), None
International Search Report and Written Opinion for corresponding International Application No. PCT/US06/11712 dated Mar. 1, 2007.
International Search Report and Written Opinion for corresponding International Application No. PCT/US06/16143 dated Apr. 27, 2007.
Kim, J. and Boruch, J., “Enabling a Microelectronic World™”, AMKOR Technology, Inc. 2002 Annual Report, retrieved from Internet:<URL:http://media.corporate-ir.net/media—files/irol/11/115640/2002AnnualReport.pdf.
Carson Flynn
Karnezos Marcos
Chambliss Alonzo
Stats Chippac Ltd.
LandOfFree
Semiconductor package including second substrate and having... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Semiconductor package including second substrate and having..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor package including second substrate and having... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3979529