Circuit device and manufacturing method thereof

Details Circuit device and manufacturing method thereof Circuit device and manufacturing method thereof

2004-09-29

2008-09-02

Weiss, Howard (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With stress relief

C257S676000, C257S784000, C257S787000

Reexamination Certificate

active

07420266

ABSTRACT:
Provided is a circuit device having conductive patterns which are equally spaced apart and a manufacturing method thereof. A method for manufacturing a circuit device of the present invention includes the steps of: preparing a conductive foil; forming conductive patterns, which are included in a unit having at least regions for mounting circuit elements, by forming isolation trenches having a uniform width in the conductive foil; electrically connecting the conductive patterns to the circuit elements; sealing with a sealing resin so as to cover the circuit elements and to be filled in the isolation trenches; and removing the conductive foil in its thickness portions where no isolation trenches are provided.

REFERENCES:
patent: 5637922 (1997-06-01), Fillion et al.
patent: 6548328 (2003-04-01), Sakamoto et al.
patent: 6562660 (2003-05-01), Sakamoto et al.
patent: 6706547 (2004-03-01), Sakamoto et al.
patent: 6946724 (2005-09-01), Igarashi et al.
patent: 6955942 (2005-10-01), Kobayashi et al.
patent: 2003/0111707 (2003-06-01), Takaura et al.
patent: 2002-76246 (2002-03-01), None

Affiliated with

Also associated with

Rating

Circuit device and manufacturing method thereof does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Circuit device and manufacturing method thereof, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Circuit device and manufacturing method thereof will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3971050