Methods of forming bumps using barrier layers as etch masks

Details Methods of forming bumps using barrier layers as etch masks Methods of forming bumps using barrier layers as etch masks

2005-03-09

2008-09-23

Coleman, W. David (Department: 2823)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S613000, C257SE21508

Reexamination Certificate

active

07427557

ABSTRACT:
Forming an electronic structure may include forming a seed layer on a substrate, and forming a mask on the seed layer. The mask may include an aperture therein exposing a portion of the seed layer, and a barrier layer may be formed on the exposed portion of the seed layer. A bump may be formed on the barrier layer, and the mask may be removed. In addition, portions of the seed layer may be selectively removed using the barrier layer as an etch mask.

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