Method of fabricating circuit board having different...

Details Method of fabricating circuit board having different... Method of fabricating circuit board having different...

2007-06-06

2008-09-02

Vu, David (Department: 2818)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C257S638000

Reexamination Certificate

active

07419897

ABSTRACT:
A method of fabricating an electrical connecting structure of a circuit board is disclosed. The method includes: providing a circuit board having a plurality of first and a plurality of second conductive pads; forming on the circuit board a solder mask having a plurality of openings to thereby expose the first and the second conductive pads; forming an metal adhesive layer on the first and the second conductive pads; forming a conductive layer on the circuit board and the metal adhesive layer; forming on the conductive layer a resistive layer, wherein a plurality of openings are formed in the resistive layer to expose the conductive layer on the second conductive pads; forming a metal post by electroplating through the conductive layer on the second conductive pads; removing the resistive layer and the conductive layer covered underneath; and forming a soldering layer on the metal post.

REFERENCES:
patent: 5400948 (1995-03-01), Sajja et al.
patent: 5672542 (1997-09-01), Schwiebert et al.
patent: 6258705 (2001-07-01), Chien et al.
patent: 6551917 (2003-04-01), Cobbley et al.

Affiliated with

Also associated with

Rating

Method of fabricating circuit board having different... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of fabricating circuit board having different..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of fabricating circuit board having different... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3966976