Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2005-12-13
2008-09-09
Louie, Wai-Sing (Department: 2814)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C438S637000, C438S640000, C438S667000, C438S672000
Reexamination Certificate
active
07422978
ABSTRACT:
Various embodiments of an interposer for mounting a semiconductor die, as well as methods for forming the interposer, are disclosed. The interposer includes flexible solder pad elements that are formed from a core material of the interposer, such that the interposer may absorb thermally induced stresses and conform to warped or uneven surfaces. Embodiments of electronic device packages including a semiconductor die mounted to and electrically connected to the interposer, as well as methods for forming the electronic device packages, are also disclosed. In one electronic device package, the semiconductor die is electrically connected to the interposer with wire bonds attached to a routing layer of the interposer. In another electronic device package, the semiconductor die is electrically connected to the interposer by bonding the semiconductor die to the flexible solder pad elements of the interposer in a flip-chip configuration. A computer system incorporating an electronic device package with an interposer according to the present invention is also disclosed.
REFERENCES:
patent: 4642889 (1987-02-01), Grabbe
patent: 4648179 (1987-03-01), Bhattacharyya et al.
patent: 5086558 (1992-02-01), Grube et al.
patent: 5239448 (1993-08-01), Perkins et al.
patent: 5386627 (1995-02-01), Booth et al.
patent: 5468681 (1995-11-01), Pasch
patent: 5631557 (1997-05-01), Davidson
patent: 6031292 (2000-02-01), Murakami et al.
patent: 6080936 (2000-06-01), Yamasaki et al.
patent: 6258627 (2001-07-01), Benenati et al.
patent: 6266874 (2001-07-01), DiStefano et al.
patent: 6312614 (2001-11-01), Arimitsu et al.
patent: 6459150 (2002-10-01), Wu et al.
patent: 6586830 (2003-07-01), Saito
patent: 6628527 (2003-09-01), Muramatsu et al.
patent: 2003/0146510 (2003-08-01), Chien
patent: 2003/0166312 (2003-09-01), Lee
patent: 2004/0201396 (2004-10-01), Pierson et al.
patent: 2006/0024861 (2006-02-01), Cordes et al.
LandOfFree
Methods of manufacturing interposers with flexible solder... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Methods of manufacturing interposers with flexible solder..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Methods of manufacturing interposers with flexible solder... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3966923