Method of manufacturing a device having a contacting structure

Details Method of manufacturing a device having a contacting structure Method of manufacturing a device having a contacting structure

2004-01-23

2008-09-23

Sarkar, Asok K (Department: 2891)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C438S055000, C257S736000, C257SE23004, C257SE21499

Reexamination Certificate

active

07427532

ABSTRACT:
According to the invention, a layer made of an electrically insulating material is applied to a substrate and a component that is arranged thereupon in such way that said layer follows the surface contour formed by the substrate and the component.

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