Semiconductor device having RF shielding and method therefor

Details Semiconductor device having RF shielding and method therefor Semiconductor device having RF shielding and method therefor

2006-02-28

2008-03-11

Smith, Zandra V. (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

C257S728000

Reexamination Certificate

active

07342303

ABSTRACT:
A semiconductor device and method of manufacturing has a substrate having a plurality of metal layers. At least one metal layer is exposed on at least one side surface of the semiconductor device. A die is coupled to the substrate. A mold compound encapsulates the die and a top surface of the substrate. A conductive coating is applied to the mold compound and to at least one metal layer exposed on at least one side surface of the substrate.

REFERENCES:
patent: 5468999 (1995-11-01), Lin et al.
patent: 5557142 (1996-09-01), Gilmore et al.
patent: 6423570 (2002-07-01), Ma et al.
patent: 7030469 (2006-04-01), Mahadevan et al.
patent: 7030489 (2006-04-01), Kang et al.
patent: 2007/0030661 (2007-02-01), Morris et al.

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