Semiconductor device having two-layered charge storage...

Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated... – Including dielectric isolation means

Reexamination Certificate

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C257SE21548, C438S427000

Reexamination Certificate

active

11373982

ABSTRACT:
A first insulation film, a first conductor film, and a cap are sequentially formed on a semiconductor substrate. The first insulation film, the first conductor film, and the cap, and the substrate are etched in the same pattern. A second insulation film is placed in that etched pattern. The cap is removed. A second conductor film is formed on the side face of the second insulation film.

REFERENCES:
patent: 6153494 (2000-11-01), Hsieh et al.
patent: 6171909 (2001-01-01), Ding et al.
patent: 6310374 (2001-10-01), Satoh et al.
patent: 6342715 (2002-01-01), Shimizu et al.
patent: 6391722 (2002-05-01), Koh
patent: 6479858 (2002-11-01), Krivokapic
patent: 11-87543 (1999-03-01), None
patent: 11163304 (1999-06-01), None
patent: H11-261038 (1999-09-01), None
patent: H10-335497 (1999-12-01), None
patent: 2000-232169 (2000-08-01), None

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