Method of preparing a sample for examination in a TEM

Radiant energy – Inspection of solids or liquids by charged particles – Electron microscope type

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C250S310000, C250S440110, C250S492100, C250S497100, C250S397000, C073S864910

Reexamination Certificate

active

11334929

ABSTRACT:
A method of preparing a sample for examination in a TEM, where the sample is attached to a probe tip point, uses a TEM sample holder form embodied in a TEM sample holder coupon. The probe-tip points and the TEM sample holder coupon are oriented with each other so that the sample is approximately centered in the TEM sample holder form. The probe-tip points are embedded in the TEM sample holder form by means of a press, simultaneously cutting off that portion of every probe-tip point outside the boundary of the TEM sample holder form and cutting the TEM sample holder free from the TEM sample holder coupon. The operation can be formed inside or outside of a focused ion-beam instrument.

REFERENCES:
patent: 5270552 (1993-12-01), Ohnishi et al.
patent: 6080991 (2000-06-01), Tsai
patent: 6300631 (2001-10-01), Shofner
patent: 6523239 (2003-02-01), Peterson et al.
patent: 6664552 (2003-12-01), Shichi et al.
patent: 6714289 (2004-03-01), Haraguchi
patent: 6717156 (2004-04-01), Sugaya et al.
patent: 7227140 (2007-06-01), Skidmore et al.
patent: 2002/0000522 (2002-01-01), Alani
patent: 2003/0150836 (2003-08-01), Tsung et al.
patent: 2004/0004186 (2004-01-01), Jiyan et al.
patent: 2004/0016880 (2004-01-01), Reiner et al.
patent: 2004/0178355 (2004-09-01), Rasmussen
Altmann, F., FIB-Pinpointed Preparation of TEM Samples by a Needle Based Manipulator (Lift-Out) Technique, Practical Metallography, 2003, pp. 175-183, vol. 40, No. 4.
Anderson, R., Comparison of FIB TEM Specimen Preparation Methods, Microscopy and Microanalysis, 2002, p. 44, vol. 8, Suppl. 2.
Bicais-Lepinay, N.; Andre, F.; Pantel, R.; Jullian, S.; Margain, A.; Kwakman, L. F Tz, Lift-out techniques coupled with advanced TEM characterization methods for electrical.
Burkhardt, C., Nisch, W., In-Situ Lift-Oout of TEM—Samples by Micro Manipulation in a Scanning Electron Microscope, Practical Metallography, 2004, pp. 190-198, vol. 41.
Crawford, E. J.; Cignac, L.; Barth, K.; Petrus, J.; Levine, E., Focused Ion Beam Sectioning and Lift-out Method for Copper and Resist Vias in Organic Low-k Dielectrics, Mic.
Dai, J. Y.; Tee, S. F.; tay, c. I.; song, z. g.; Ansari, S.; Er, E.; Redkar, S., Development of a rapid and automated TEM sample preparation method in semiconductor failure a.
Engelmann, H. J., Volkmann, B. Zschech, E., From SEM Cross-Section to TEM Sample—New Capabilities of FIB Sample Preparation by “Refill” Technique, Practical Metallography.
Gnauck, P.; Hoffrogge, P.; Schumann, M.; Bauhammer, G., Enhanced Site specific Preparation of SESM Cross Sections and TEM Samples by using CrossBeam Technology, Microscopy and.
Kempshall, B.W., Schwarz, S.M., Giannuzzi, L.A., In-Situ FIB lift-out for site specific TEM specimen preparation of grain boundaries and interfaces, ICEM s5, 2002, pp. 249-.
Kempshall, B.W. and Giannuzzi, L. A., In-Situ Lift-Out FIB Specimen Preparation for TEM of Magnetic Materials, Microscopy and Microanalysis, 2002, pp. 390-391, vol. 8 Suppl.
Landford, R.M., Petford-Long, A.K. and Gnauck, P., Focused Ion Beam Based Sample Preparation Techniques, Microscopy & Microanalysis, 2002, pp. 46-47, vol. 8, Suppl. 2, Lee, J.
Chuang, J.H., A Novel Application of the FIB Lift-out Technique for 3-D TEM Analysis, Microelectronics Reliability, 2001, pp. 1551-1556, vol. 41.
Mohammad, K.N.; Sim, K.S., Novel Application of FIB Lift-out and Ultramicrotomy for Advanced Package Failure Analysis, Proceedings of the 9th International Symposium on the.
Subramanian, Swaminathan; Rose, stewart; conner, james; schani, Phil; Moss, Jamey, Specific Area Planar and Cross-Sectional Lift-Out Techniques; Procedures and Novel Applicati.
Ritz, Y., Stegmann, H., Engelmann, H.J., Zschech, E., Target Preparation of Samples for 3D-TEM Using Micromanipulator, Pratical Metallography, 2004, pp. 180-189, vol. 41.
Shofner, T.L.; Drown, J.L.; Brown, S.R.; Rossie; B.B.; Decker, M.A.; Obeng, Y.S.; Stevie, F.A., Planar TEM Analysis of Nanoindented Samples Using the Focused Ion Beam.
Stevie, F.A.; Irwin, R.B.; Shofner, T.L.; Brown, S.R.; Drown, J.L.; Giannuzzi, L.A., Plan View TEM Sample Preparation Using the Focused Ion Beam Lift-Out Technique, CP449.
Veirman De, A.E.M., ‘3-Dimensional’ TEM silicon-device analysis by combining plan-view and FIB sample preparation, Materials Schience & Engineering B, 2003, pp. 63-69, vol.
Gnauck, P.; Zeile, U.; Hoffrogge, P.; Benner, G.; Orchowski, A.; Rau, W.D., Real time SEM imaging FIB of milling processes for extended accuracy on TEM samples for EFTEM analy.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method of preparing a sample for examination in a TEM does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of preparing a sample for examination in a TEM, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of preparing a sample for examination in a TEM will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3944064

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.