Radiant energy – Irradiation of objects or material – Irradiation of semiconductor devices
Reexamination Certificate
2008-04-01
2008-04-01
Berman, Jack (Department: 2881)
Radiant energy
Irradiation of objects or material
Irradiation of semiconductor devices
C250S398000, C250S492200, C118S045000, C118S730000, C204S192100, C204S192350, C216S062000
Reexamination Certificate
active
10519623
ABSTRACT:
A wafer support for an ion implanter includes a wafer holder and a support arm for the holder in the implant chamber. A portion of the support arm adjacent the wafer holder is at least intermittently exposed to the ion beam during implantation, as a result of the relative scanning of the ion beam and the wafer holder. An arm shield mechanism has a plurality of shielding surfaces which can be selectively disposed to receive the ion beam to protect the exposed portion of the support arm. The shielding surfaces may form a sleeve arranged over the arm which may be rotatable above the arm to present selected surfaces to the ion beam. Cross contamination when successively implanting different species can be reduced by presenting different shield surfaces to the beam.
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Murrell, A., Wauk, M. Clarke, N. Burgin, D. Scotney-Castle, M Lee, R.M. Carpentier, K. Harringon, K. “ Dopant Cross-Contamination Reduction with a 3-Position Beamstop”,1997, Proceedings of the 11th International Conference on Ion Implantation Technology, pp. 147-150.
Applied Materials Inc.
Berman Jack
Boult Wade & Tennant
Sahu Meenakshi S
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