Sputtering apparatus and process for forming lamination film emp

Details Sputtering apparatus and process for forming lamination film emp Sputtering apparatus and process for forming lamination film emp

Filed on

1992-11-03

Date issued

1994-07-12

Examiner

Nguyen, Nam

Patent Class

Chemistry: electrical and wave energy

SubClass

Processes and products

SubSubClass

Coating, forming or etching by sputtering

Other Related Categories

20419215, 2041922, 20429808, 20429811, 20429815, 20429826, 20429828, C23C 1434

Type

Patent

Status

active

Patent number

053285832

Description

ABSTRACT:
A sputtering apparatus comprises at least one pair of first sputtering targets arranged in counterposition; a second sputtering target provided substantially on a concentric circle having the center axis of the first sputtering targets; and a substrate holder for holding a substrate to be coated with particles of target materials emitted from the first sputtering targets and the second sputtering target, which is provided substantially on another concentric circle having the center axis outside the second sputtering target.

REFERENCES:
patent: 4767516 (1988-08-01), Nakatsuka et al.
patent: 4997539 (1991-03-01), Komizo et al.
patent: 5000834 (1991-03-01), Yoshikawa
Ohyo Butsuri (Applied Physics), vol. 48, No. 6 (1979) pp. 558-559.

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