Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Making electrical device
Reexamination Certificate
2008-03-04
2008-03-04
Lee, Sin (Department: 1752)
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Making electrical device
C430S311000, C430S313000, C430S319000, C430S329000, C430S324000, C430S325000, C430S326000, C430S330000, C430S270100, C430S281100, C430S285100, C430S280100, C430S284100
Reexamination Certificate
active
10473466
ABSTRACT:
An object of the present invention is to provide a process for producing a printed wiring board, which is advantageous not only in that the reduction in size and increase in density of the wiring board are achieved and further the steps are simplified, but also in that the connection reliability of mount parts and the yield are improved, and a photosensitive resin composition used in the process. The present invention is directed to a process for producing a printed wiring board, comprising the steps of: (i) forming a solder resist on a wiring board having a circuit; (ii) laminating a preliminarily molded layer of a photosensitive resin composition on the solder resist; (iii) subjecting the layer of the photosensitive resin composition to exposure and development to form a resist pattern of the photosensitive resin composition; (iv) subjecting the entire surface of the resultant board to electroless plating, and (v) stripping the layer of the photosensitive resin composition, wherein the steps are conducted in this order, as well as a photosensitive resin composition and the layer thereof used in the process.
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Machine-assisted English translation of JP 10-051107, provided by JPO.
Machine-assisted English translation of JP 9-265188, provided by JPO.
Machine-assisted English translation of JP 6-282069, provided by JPO.
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Akahori Toshihiko
Aoki Tomoaki
Kajiwara Takuya
Natori Michiko
Sawabe Ken
Griffin & Szipl, P.C.
Hitachi Chemical Co. Ltd.
Lee Sin
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