On chip heating for electrical trimming of polysilicon and...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material

Reexamination Certificate

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C257SE21595

Reexamination Certificate

active

11182981

ABSTRACT:
An integrated circuit programmable structure (60) is formed for use a trim resistor and/or a programmable fuse. The programmable structure comprises placing heating elements (70) in close proximity to the programmable structure (60) to heat the programmable structure (60) during programming.

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patent: 6586282 (2003-07-01), Takasu
patent: 2002/0008302 (2002-01-01), Singh et al.

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