Thermally coupling an integrated heat spreader to a heat...

Details Thermally coupling an integrated heat spreader to a heat... Thermally coupling an integrated heat spreader to a heat...

2008-04-29

2008-04-29

Stoner, Kiley (Department: 1793)

Metal fusion bonding

Process

Plural joints

C228S234100, C228S246000

Reexamination Certificate

active

10914359

ABSTRACT:
The base of a heat sink may be selectively plated with a solder wetting material and soldered to an integral heat spreader also selectively plated with gold. In another embodiment, the solder may be applied in the form of an insert made up of an electrical heating wire sandwiched between indium foil which acts as solder when heated by the intervening wire.

REFERENCES:
patent: 4995546 (1991-02-01), Regnault
patent: 6324072 (2001-11-01), Lorenz et al.
patent: 2002/0043402 (2002-04-01), Juskey et al.
patent: 2002/0105071 (2002-08-01), Mahajan et al.
patent: 2002/0114963 (2002-08-01), Petkie
patent: 2005/0280142 (2005-12-01), Hua et al.
patent: 2006/0051898 (2006-03-01), Lu et al.
patent: 2006/0227510 (2006-10-01), Fitzgerald et al.

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